PCB Assembly Capability

PCB Assembly Capability

Component Mounting Specification	Minimum Precision	0201
	Maximum Height	20mm
	Minimum Spacing	BGA 0.4 Pitch
		IC 0.3 Pitch
Board Specification	Maximum Size	450 ╳ 730mm
	Board Thickness	0.3~6mm
	Board Type	Rigid Board, Flex Board and Rigid-flex Board
Type of Solder	HASL-free, HASL
SMT	POP, Bonding, Auto Plug-in
production capacity	THT:100,000/month
	SMT:2,000,000/day
Testing Capability	AOI, X-ray Inspection, ICT Testing, Flying Probe Testing, Function test, burn-in test

Advantages:
✓No MOQ
✓5 years of PCB&PCBA turnkey services
✓Quick turn, Prototype, Low & medium & high volume
✓Components sourcing, ODM&OEM services provide
✓UL, ISO 9001-, ISO14001-, ISO/TS16949, ISO13485, IATF16949, OHSAS18001 certified,
✓100% E-test,100% visual inspection, including IQC, IPQC, FQC and OQC
✓100% AOI inspection, including X-ray, 3D microscope and ICT
✓Fast response within 24 hours,great pre-sales, sales, after-sales
✓All kinds of payment:T/T, Paypal, WesternUnion
✓Guarantee Sales Service,for all problems encountered kindly contact us, we will do the after service any time.
✓All kinds of Export/Import Processing Support,EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express